发明名称 Pinned photodiode structure in a 3T active pixel sensor
摘要 An active pixel sensor cell, and the process for forming the active pixel sensor cell, featuring a pinned photodiode structure, and a readout region, located in a region of the pinned photodiode structure, has been developed. The process features the formation of a N+ readout region, performed simultaneously with the formation of the N+ source/drain region of the reset transistor, however with the N+ readout region placed in an area to be used for the pinned photodiode structure. The pinned photodiode structure is next formed via formation of a lightly doped N type well region, used as the lower segment of the pinned photodiode structure, followed by the formation of P+ region, used as the top segment of the pinned photodiode structure, with the N+ readout region, surrounded by the P+ region. The placement of the N+ readout region, in a region of the pinned photodiode structure, eliminates the need for a transfer transistor, for the active pixel sensor cell, and results in a higher signal to noise ratio, as well as lower dark current generation, than counterparts fabricated without the use of the process, and structure, of this invention.
申请公布号 US6372537(B1) 申请公布日期 2002.04.16
申请号 US20000527182 申请日期 2000.03.17
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 LEE CHI-HSIANG;CHIANG AN-MING;YEH WEI-KUN;YANG HUA-YU
分类号 H01L21/00;H01L27/146;H01L31/06;H01L31/109;(IPC1-7):H01L21/00 主分类号 H01L21/00
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