| 发明名称 |
Perforated heat sink |
| 摘要 |
A compact perforated heat sink having high heat dissipation has a substrate with a multitude of holes and a thermal conductive pathway to conduct heat from a heat source to the substrate. The surface area of the holes is equal to or greater than the surface area of the substrate without the holes.
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| 申请公布号 |
US6371200(B1) |
申请公布日期 |
2002.04.16 |
| 申请号 |
US20010922538 |
申请日期 |
2001.08.03 |
| 申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY |
发明人 |
EATON DERAN S. |
| 分类号 |
C06B25/02;C06B25/12;C06B47/00;(IPC1-7):F28F7/00;H05K7/20 |
主分类号 |
C06B25/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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