NEW THERMOPLASTIC POLYIMIDE RESIN AND FLEXIBLE METAL FOIL-CLAD LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a copper-clad laminate especially excellent in resistance to soldering heat after moisturized. SOLUTION: This flexible metal foil-clad laminate is formed by thermally laminating a heat-resistant bond ply having a thermoplastic polymide layer and a layer or metal foil on one or both of the surfaces of a heat-resistant base film, wherein the thermoplastic polyimide does not become cloudy nor the thermoplastic polyimide is released from the metal foil, when subjected to solder-dipping test at 280 deg.C for 10 sec after moisturized at 40 deg.C in 90 RH% for 96 hr. The copper-clad laminate having excellent adhesiveness and excellent resistance to soldering heat is realized by using a main acid component comprising hydroquinone bis(anhydrotrimellitic acid) ester monomer (TMHQ) as the thermoplastic polyimde layer.