发明名称 Slicing device using yarn for cutting thin wafers using the angular intersection of at least two yarn layers
摘要 A slicing device using yarn includes at least two yard-guide cylinders on which the yarn is wound and by which the yarn can be moved with a reciprocating or continuous motion pressed against a piece to be sliced fixed on a supporting table. The yarn is wound on the yarn-guide so as to form at least two layers of yarn intersecting with one or several non-null intersecting angles (beta) and so as to pass in a straight line from one cylinder to the other. The angle of inclination between the moving direction of the piece to be sliced and a line perpendicular to the plane of the yarn cylinder axes is adjustable so as to obtain strictly parallel slices. The intersection of the yarn layers improves the quality of slices obtained by facilitating the subsequent mechanical treatment operations of surfaces with crossed faults. Moreover, the angle of the yarn layers reduces the shearing and torsional stresses on the support of the piece to be sliced when the slices are being cut.
申请公布号 US6371101(B1) 申请公布日期 2002.04.16
申请号 US19990423366 申请日期 1999.11.08
申请人 HCT SHAPING SYSTEMS SA 发明人 HAUSER CHARLES
分类号 B24B27/06;B23D57/00;B28D5/04;(IPC1-7):B28D1/06;B28D7/06 主分类号 B24B27/06
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