| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin forming material for sealing that has excellent reflow crack resistance and void properties with reduced chip shift even in the thin surface-mounting type package and provide electronic part device equipped with elements sealed with the same. SOLUTION: The objective epoxy resin for sealing includes, as essential components, (A) an epoxy resin, (B) a curing agent, (C) a hardening accelerator, (D) a filler and has the SDR viscosity of <=100 Pa.s and the objective electronic part device is equipped with the elements sealed with the same. |
