发明名称 Method and apparatus for monitoring and/or end point detecting a process
摘要 The present invention describes a method of end point detecting a process. According to the present invention a surface characteristic is continually measured while the substrate is being processed. A predetermined change in the surface characteristic is utilized a signal and end to the processing step.
申请公布号 US6374150(B2) 申请公布日期 2002.04.16
申请号 US19980126552 申请日期 1998.07.30
申请人 APPLIED MATERIALS, INC. 发明人 REDINBO GREGORY F.;RAVI JALLEPALLY;RIVKIN MICHAEL
分类号 H01L21/205;H01L21/02;H01L21/285;H01L21/31;H01L21/66;(IPC1-7):G06F19/00;G01J5/00 主分类号 H01L21/205
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