发明名称 |
Semiconductor device having bonding wire spaced from semiconductor chip |
摘要 |
A semiconductor device has a semiconductor chip fixedly mounted on an island and a bonding wire connecting a bonding pad on the semiconductor chip to a lead terminal whose end is positioned near the island. The semiconductor chip and the bonding wire are encased by a molded resin. The bonding wire includes a first extension ascending substantially vertically from the bonding pad, a second extension extending substantially horizontally from the first extension, and a third extension descending substantially vertically from the second extension. A bend between the second and third extensions is disposed outwardly of an end of the semiconductor chip.
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申请公布号 |
US6372625(B1) |
申请公布日期 |
2002.04.16 |
申请号 |
US19980138616 |
申请日期 |
1998.08.24 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
SHIGENO TAKASHI;ISAKI OSAMU |
分类号 |
H01L21/60;H01L21/607;H01L23/495;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L23/48;H01L23/52 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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