CURABLE RESIN COMPOSITION AND METAL BASE CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a metal base circuit board excellent in stress relaxing properties and further excellent in insulation reliability and heat radiating properties. SOLUTION: This curable resin composition consists essentially of an epoxy resin, a curing agent having a polyether skeleton and primary amine groups at terminals of the main chain, a silane coupling agent having a ureido group and/or a mercapto group and a inorganic filler. The metal base circuit base uses the curable resin composition.