发明名称 |
ZIF memory module assembly |
摘要 |
An enhanced memory module assembly comprises a memory module including a substrate with a plurality of conductive traces arranged in an edge thereof. A connector includes a first housing having a memory module receiving slot extending along a longitudinal direction thereof. The housing further defines a plurality of terminal cells with a plurality of first terminals assembled therein. Each terminal includes a first end extending into the elongate slot for electrically contacting with the conductive traces. A ZIF device is arranged between the memory module and includes a pair of actuator receiving slots located in the housing and in communicating with the terminal cells, and an actuator attached to the memory module. The actuator includes a pair of actuating plates extending into the actuator receiving slots thereby pushing the terminals in electrical contact with the conductive traces when the memory module is completely inserted therein.
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申请公布号 |
US6371781(B1) |
申请公布日期 |
2002.04.16 |
申请号 |
US20000653926 |
申请日期 |
2000.09.01 |
申请人 |
HON HAI APRECISION IND. CO., LTD. |
发明人 |
JONES DENNIS B.;CHENG ANDREW |
分类号 |
H01R12/16;H01R12/18;(IPC1-7):H01R13/62 |
主分类号 |
H01R12/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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