发明名称 ZIF memory module assembly
摘要 An enhanced memory module assembly comprises a memory module including a substrate with a plurality of conductive traces arranged in an edge thereof. A connector includes a first housing having a memory module receiving slot extending along a longitudinal direction thereof. The housing further defines a plurality of terminal cells with a plurality of first terminals assembled therein. Each terminal includes a first end extending into the elongate slot for electrically contacting with the conductive traces. A ZIF device is arranged between the memory module and includes a pair of actuator receiving slots located in the housing and in communicating with the terminal cells, and an actuator attached to the memory module. The actuator includes a pair of actuating plates extending into the actuator receiving slots thereby pushing the terminals in electrical contact with the conductive traces when the memory module is completely inserted therein.
申请公布号 US6371781(B1) 申请公布日期 2002.04.16
申请号 US20000653926 申请日期 2000.09.01
申请人 HON HAI APRECISION IND. CO., LTD. 发明人 JONES DENNIS B.;CHENG ANDREW
分类号 H01R12/16;H01R12/18;(IPC1-7):H01R13/62 主分类号 H01R12/16
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