发明名称 |
Soldering alloy, cream solder and soldering method |
摘要 |
The present invention relates to a soldering alloy composed mainly of Sn and free from lead, a toxic substance. Adding a small quantity of Ag to the soldering alloy can make the alloy structure fine, minimize structural changes of the alloy and increase its thermal fatigue resistance. Adding a small quantity of Bi to the soldering alloy lowers the melting point and improves the alloy's wettability. Further, adding a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.
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申请公布号 |
US6371361(B1) |
申请公布日期 |
2002.04.16 |
申请号 |
US19990252787 |
申请日期 |
1999.02.19 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YAMAGUCHI ATSUSHI;FUKUSHIMA TETSUO |
分类号 |
B23K35/02;B23K35/26;(IPC1-7):B23K28/00;C22C13/00 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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