发明名称 Semiconductor manufacturing facility
摘要 A cooling jacket unit (5) is provided to a periphery of a heating furnace of a heat treatment apparatus. A cooling unit has a double water jacket comprising an inner fluid passage (51) and an outer fluid passage (52), and cooling water supplied to the outer fluid passage exits from the inner fluid passage. The temperatures of the inlet port and the outlet port of the cooling jacket unit (5) are set to, for example, 40° C. and 85° C., respectively, and the cooling water (warmed exhaust water) from the outlet port is supplied to a heat recovery part (2). Heat is recovered from the cooling water by the heat recovery part (29, and the recovered heat is reused for heating a boiler water and the like. The warmed exhaust water from which the heat is recovered is supplied again to the cooling jacket unit (5) as the cooling water.
申请公布号 US6370897(B1) 申请公布日期 2002.04.16
申请号 US20000670343 申请日期 2000.09.27
申请人 TOKYO ELECTRON LIMITED;OHMI TADAHIRO;TAISEI CORPORATION 发明人 SUENAGA OSAMU;OHMI TADAHIRO;KOBAYASHI SADAO
分类号 H01L21/00;(IPC1-7):F25B27/00;F28D15/00 主分类号 H01L21/00
代理机构 代理人
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