| 发明名称 |
Preformed thermal fuse |
| 摘要 |
A preformed thermal fuse comprising two electrodes, at least one layer of solder, and a conductive bridge comprising a non-paste solder material is disclosed. The conductive bridge has a melting temperature which is substantially equivalent to the predetermined actuation temperature of the fuse.
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| 申请公布号 |
US6373371(B1) |
申请公布日期 |
2002.04.16 |
| 申请号 |
US19990376726 |
申请日期 |
1999.08.17 |
| 申请人 |
MICROELECTRONIC MODULES CORP. |
发明人 |
DOERRWAECHTER BERNHARD E.;PATHAMMAVONG KECK C.;KRACHENFELS KURT M. |
| 分类号 |
H01H37/76;H02H9/04;H05K1/00;H05K1/09;H05K3/34;(IPC1-7):H01H85/046;H01H69/02 |
主分类号 |
H01H37/76 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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