| 摘要 |
PROBLEM TO BE SOLVED: To provide electric and electronic parts obtained from a molding material for electric and electronic parts without standing out in relief of a reinforced material from the surface of parts of a molding form by heating in a reflow soldering step, for example, even if submitted to the reflow soldering step using lead-free solder. SOLUTION: A molding material for electric and electronic parts comprises: an aromatic polyamide resin (A) where the melting point is from not less than 280 deg.C to less than 330 deg.C and concentration of terminal amino groups is 10-150 mmol/kg; and an inorganic reinforced material and/or an organic reinforced material (B) dispersed in the aromatic polyamide resin (A), and the surface of the reinforced material is treated with a surface-treating agent. In addition, the electric and electronic parts consist of the above materials.
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