| 摘要 |
PROBLEM TO BE SOLVED: To obtain a prepreg for printed wiring plates suppressed in resin flow during molding without reducing Tg, heat resistance and processability and provide a lamination plate having high accuracy in thickness. SOLUTION: This method for producing a prepreg is to impregnate a varnish obtained by blending (a) a straight chain high molecular epoxy resin having an epoxy group on the reaction terminal, 100-1000 epoxy equivalent and >=10000 weight average molecular weight, (b) a lower molecular epoxy resin having 100-1000 epoxy equivalent and <=5000 weight average molecular weight, (c) a curing agent and (d) a hardening accelerator as essential ingredients, to a glass woven fabric or a glass nonwoven fabric and heat the fabric to be in the B stage. In this case, good characteristics are obtained by blending 1-15 pts.wt. of (a) based on 100 pts.wt. of the total solid in the epoxy resin.
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