Method of producing semiconductor device and configuration thereof, and lead frame used in said method

摘要

Providing a method of producing a semiconductor device wherein semiconductor element are sealed with a resin by using the same lead and other means regardless of the specifications of the semiconductor elements, and a semiconductor device which can be reduced in size and weight and has good heat dissipation performance and high-frequency performance.The semiconductor devices can be produced by mounting a plurality of the semiconductor elements on the lead frame having leads disposed substantially parallel to each other, sealing the whole with a resin, and cutting off the individual semiconductor devices.