| 摘要 |
An apparatus for the temperature regulation processing of electronic components such as semiconductor circuits, printed circuit boards and the like comprises a temperature regulated housing through which the components are conveyed on carriers. The carriers enter through an inlet slot in the housing provided with temperature regulating members and are conveyed onto a magazine and then out through an outlet slot opposite the inlet slot once processing is complete. Inside the housing, the carriers are loaded on a progressively loaded magazine provided with adjacently arranged holders. Once all the holders are loaded, the magazine is filled and in an end position. The magazine is then displaced to its starting position in a fast reverse run. A new carrier is conveyed in through the inlet slot thereby causing the temperature regulated carrier occupying the holder to be conveyed out through the outlet slot.
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