| 摘要 |
PURPOSE: A method for manufacturing a tantalum chip condenser is provided to improve the efficiency of manufacture by coating a negative terminal only after manufacturing the tantalum chip condenser in a mold type. CONSTITUTION: A connecting unit(41) is formed on the center of lateral of respective products(40) to form a built-in type mold. An upper plate(42) is sticked fast to the center of the mold product. A negative terminal of the mold product is plated in a plating bath with Pd(palladium) and Ni(nickel). The negative terminal of the mold product is further plated in a plating bath with Sn(tin) and Pb(plumbum). Thereafter, the upper plate(42) is removed and the connecting unit(41) is cut. Then, a positive terminal of the mold product is formed. |
