发明名称 APPARATUS FOR PROCESSING ELECTRONIC COMPONENT CARRIER TAPE USING ULTRASONIC WAVE
摘要 PURPOSE: An apparatus for processing an electronic component carrier tape using the ultrasonic wave is provided to prevent the generation of fluff by using a friction due to oscillation and a frictional heat due to the friction. CONSTITUTION: A punch(110) is provided on its end with a protuberance for forming an electronic component receiving unit. A punch driving unit(140) operates up and down the punch(110) with a predetermined time interval. An oscillation generating unit oscillates the punch(110) operated up and down by the punch driving unit(140) with a predetermined frequency. A jig(120) is installed opposite to the punch(110) and helps the molding of the electronic component receiving unit. The oscillation generating unit includes an ultrasonic oscillator(134), an ultrasonic generator(136), a power supply(138), and an ultrasonic booster(132).
申请公布号 KR20020028031(A) 申请公布日期 2002.04.15
申请号 KR20000058907 申请日期 2000.10.06
申请人 BAE, SANG CHEUL;DUBITNARAEY CO., LTD. 发明人 BAE, SANG CHEUL
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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