发明名称 |
APPARATUS FOR PROCESSING ELECTRONIC COMPONENT CARRIER TAPE USING ULTRASONIC WAVE |
摘要 |
PURPOSE: An apparatus for processing an electronic component carrier tape using the ultrasonic wave is provided to prevent the generation of fluff by using a friction due to oscillation and a frictional heat due to the friction. CONSTITUTION: A punch(110) is provided on its end with a protuberance for forming an electronic component receiving unit. A punch driving unit(140) operates up and down the punch(110) with a predetermined time interval. An oscillation generating unit oscillates the punch(110) operated up and down by the punch driving unit(140) with a predetermined frequency. A jig(120) is installed opposite to the punch(110) and helps the molding of the electronic component receiving unit. The oscillation generating unit includes an ultrasonic oscillator(134), an ultrasonic generator(136), a power supply(138), and an ultrasonic booster(132).
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申请公布号 |
KR20020028031(A) |
申请公布日期 |
2002.04.15 |
申请号 |
KR20000058907 |
申请日期 |
2000.10.06 |
申请人 |
BAE, SANG CHEUL;DUBITNARAEY CO., LTD. |
发明人 |
BAE, SANG CHEUL |
分类号 |
H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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主权项 |
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地址 |
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