SINGULATION APPARATUS AND METHOD OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A singulation method of a semiconductor package is provided to easily singulate the semiconductor package attached to a metal carrier frame while preventing a crack of a chip, by punching the side portion of a molding surface while using a punch. CONSTITUTION: A rotating plate is closely attached to the molding surface(18) of the semiconductor package(100). The edge portion of the plate is punched by the punch(14). While the plate is rotated by the punch, the side portion of the molding surface of the semiconductor package is pushed downward and a member of the semiconductor package attached to the metal carrier frame(20) starts to be separated.