摘要 |
PURPOSE: A resistor of a printed circuit board and a forming method thereof are provided to reduce the assembly process defective and the manufacturing cost by using a resistance wire instead of a chip resistor as a resistance material. CONSTITUTION: An insulating substrate(1) comprising a circuit pattern(2) formed on an upper surface thereof is provided. A solder mask(3) is formed so as to define a resistance forming area. The solder mask(3) exposes an area including specific circuit pattern parts adjacent to the circuit pattern(2) and the insulating substrate(1). The exposed circuit patterns are interconnected by a resistance wire. An epoxy molding compound(13) covers the resistance wire and the area adjacent thereto. The epoxy molding compound(13) is coated on the area including the wire-bonded circuit pattern parts by using a stencil mask or a silk screen. The epoxy molding compound(13) is hardened at a predetermined temperature.
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