发明名称 |
A testing device for semiconductor components and a method of using the device |
摘要 |
A testing device for semiconductor components and a method of making the device is described. The testing device includes a support structure having an outer edge, and an adhesive film disposed on the support structure to hold a semiconductor wafer in position on the support structure so that neither the adhesive film nor the semiconductor wafer extends beyond the outer edge of the support structure. |
申请公布号 |
AU8912401(A) |
申请公布日期 |
2002.04.15 |
申请号 |
AU20010089124 |
申请日期 |
2001.09.18 |
申请人 |
MOTOROLA, INC. |
发明人 |
MARK D. NORRIS;JEFFREY S. HUGHES;ROY RUSSELL BROWN |
分类号 |
G01R1/04;G01R31/28;H01L21/68;H01L21/683 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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