| 摘要 |
In a method for shielding electronics, a plurality of components to be shielded are arranged on a part of an assembly base to be shielded, each of the plurality of components having a first side including a first contact surface connectable to a common earth connection of the assembly base, each of the plurality of components further having a second contact surface, the plurality of components being arranged such that, for each of the plurality of components, the first side with the first contact surface faces out toward a periphery of the part of the assembly base. For each of the plurality of components, the first contact surface is connected to the earth connection. The plurality of components are shielded with a shielding device. For each of the plurality of components, the first contact surface is closer to the shielding device than the second contact surface. |
