| 摘要 |
PURPOSE: A stack package is provided to easily dispose and connect chip select pins and to connect a bottom package and a top package by a solder ball, by exposing a part of an inner lead of the bottom package and by making the top package have a ball grid array(BGA) type. CONSTITUTION: A lead frame(23) is composed of a paddle(23a), the inner lead(23b) and an outer lead(23c). A semiconductor chip having bond pads is attached to the paddle by an edge array type. The bond pad is wire-bonded to one side surface of an adjacent inner lead portion. A space region including the semiconductor chip and the inner lead wire-bonded to the semiconductor chip is encapsulated while the other side surface of the inner lead portion is exposed. Solder balls(31) are disposed on the lower surface of the top package(40) by a BGA type. The solder balls of the top package are bonded to the exposed inner lead portion of the bottom package(30) to electrically connect the bottom package and the top package. |
