SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor package is provided to remarkably reduce the thickness of the semiconductor package by stacking the first chip which is thinly ground and omitting additional molding and wire bonding processes, and to maximumly exhaust the heat generated in the chip to the outside by making partial surfaces of the first and second chips exposed to the exterior. CONSTITUTION: An etched conductive pattern(14) is connected to upper and lower surface near a cavity(30) formed in the center of a member(12) by using a via hole(34). A cover coat(20) is applied, exposing a part of the conductive pattern to the outside. The member includes the etched conductive pattern and the cover coat. The first chip(22) is attached to the upper surface near the cavity of the member by using adhesive. The second chip(24) is attached to the conductive pattern exposed to the lower surface near the cavity of the member by using the first flip chip bump(16) while attached to a bonding pad formed on the lower surface of the first chip by using the second flip chip bump(18). Resin(26) is injected to the cavity of the member constituting a space between the first and second chips. A withdraw terminal(28) is attached to the conductive pattern exposed from the upper surface of the member to the cover coat.