WIRING BOARDS AND PROCESSES FOR MANUFACTURING WIRING BOARDS

摘要

PURPOSE: Wiring boards and processes for manufacturing wiring boards are provided to easily and reliably accomplish the grounding operation in a process for preparing a wiring board with a shield film. CONSTITUTION: In wiring board(1), a shield film(50) is connected to a specific wiring member(ground wiring)(17) at the bottoms of openings(14) in cover film(21) and the shield film(50) is wrapped from the side of cover film(21) to the side of base film(11). Therefore, shield film(50) can be placed at ground potential on not only the side of cover film(21) but also the side of base film(11), whereby wiring board(1) can be wholly shielded from the noise emitted from other electronic components. Ground wiring(17) is patterned to be wider than the other wiring members(signal wirings)(18), which allows a large current to pass and openings(14) to be made in a large diameter, so that cover film(21) can be easily aligned and more reliably connected to shield film(50).