发明名称 SUBSTRATE STRUCTURE OF SOI ELEMENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate structure of an SOI element capable of suppressing a floating body effect frequently occurring from the SOI element and a method for manufacturing the same. SOLUTION: The substrate structure of an SOI element comprises an SOI substrate 200 in which a silicon bulk substrate 201, an embedded insulating film 202, and a semiconductor body layer 203 are sequentially formed; a trench 204 formed by selectively etching the film 202 and the body layer 203; a semiconductor sidewall spacer 205 formed in the trench 204; and an insulating film 208 for isolating elements to be filled in the trench 204. The method for manufacturing the same manufactures the substrate structure of the SOI element.
申请公布号 JP2002111009(A) 申请公布日期 2002.04.12
申请号 JP20010013325 申请日期 2001.01.22
申请人 HYNIX SEMICONDUCTOR INC 发明人 KIM YOUNG-HOON
分类号 H01L29/786;H01L21/20;H01L21/84;H01L27/12;(IPC1-7):H01L29/786 主分类号 H01L29/786
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