| 摘要 |
PROBLEM TO BE SOLVED: To inhibit disconnection of a conductor 4 on the inner wall surface of a through hole 2 due to sulfuration by simple operation in electronic components using a substrate 3 that has the through hole 2 and achieves continuity between upper and lower surface via the conductor 4 on the inner wall surface of the through hole 2. SOLUTION: A lid body 1 that is arranged so that the opening of the through hole 2 is blocked is provided, and partially enters the through hole 2. In this case, the lid body 1 preferably contains a material for forming a sulfide. The material that is capable of forming the sulfide is at least on type of, for example, antimony, gold, silver, silicon, germanium, cobalt, tin, carbon (excluding diamond), iron, copper, lead, nickel, cadmium, silver, bismuth, arsenic, manganese, sodium, calcium, magnesium, phosphor, molybdenum, zinc, and the like.
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