| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing printed board by which the heights of conductive bumps can be made equal to each other. SOLUTION: In a one-sided copper-plated laminated board 2 having via holes 5, solder foil 7 is put on an insulating substrate 3 having the holes 5 and pressed against the substrate 3 with rollers 11A and 11B. Consequently, the solder foil 7 is press-contacted with the upper surfaces of plated conductors 6 packed in the holes 5, and the conductive bumps 8 are formed. When the foil 7 is pressed against the substrate 3, the surfaces of the conductors 6 are flattened by means of the rollers 11A and 11B. Since the rollers 11A and 11B have cylindrical shapes, the parallelism between the rollers 11A and 11B can be maintained by only controlling the inclinations of the rollers 11A and 11B in their axial directions. Consequently, all of the conductors 6 can be flattened evenly. In addition, since the solder foil 7 formed to have a uniform thickness is adhered to the conductors 6, the thicknesses and, accordingly, the heights of the bumps 8 can be made equal to each other.
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