MOUNTING METHOD AND STRUCTURE OF ELECTRONIC COMPONENT, AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To improve reinforcement of a circuit board and prevent failure such as cracks caused by generated stress without any increase in thickness of substrate and the number of processes. SOLUTION: Reinforcing patterns 11 are formed on at least four corners of an area where an area array type electronic component of the circuit board is mounted and filler is filled between the reinforcing patterns and the electronic component.