| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for bonding outer lead to an electrode, in prospect of a position difference that occurs when the outer lead of an electronic component made with a TAB method is attached using pressure applied to the electrode of a display panel (LCD). SOLUTION: At the outer lead bonding section C, and a first regular press- bonding section D and a second regular press-bonding section E, by aligning a first outer lead of the electronic component 6a and an electrode of a LCD 1, an outer lead is attached by pressure to the electrode. This pressure-bonding is carried out for a plurality of the LCD 1 repeatedly, and the position difference of the outer lead and the electrode, occurring with press bonding, is measured in a position difference inspection part F. The position difference measured is fed back in the outer lead bonding section C as offset data, while making compensation in prospect of this position difference, the outer lead is aligned and attached by pressure.
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