发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus capable of improving a mounting efficiency by optimizing a moving route of a transfer head. SOLUTION: Functional units disposed between supply units 4A and 4B and a conveying passage 2 of the electronic component, that is, nozzle replacing units 10A and 10B for automatically replacing suction nozzles 14, recognition units 11A and 11B for recognizing the components held at the transfer heads 7A and 7B, and recovering units 13A and 13B for recovering the components discharged without mounting on a board 3 as a result of the recognition, are linearly arranged around the units 11A and 11 in a scanning direction at the component recognition time. Thus, the moving routes of the heads 7A and 7B are optimized, and the mounting efficiency can be improved.
申请公布号 JP2002111287(A) 申请公布日期 2002.04.12
申请号 JP20000292060 申请日期 2000.09.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HORIGOME NAOYUKI;TANAKA SATOSHI;HIRAHARA TAKASHI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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