| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that cannot be damaged during manufacture and packaging by protecting the periphery of a semiconductor chip with a metal cover and a sealing resin and preventing a semiconductor substrate of Si or the like from being exposed to the surface, and a method for manufacturing the semiconductor device. SOLUTION: A metal case 8 where a recess 8a is formed by stamping or the like is prepared, and the back surface of a semiconductor chip 1 is fixed onto an internal bottom surface at the recess 8a by a conductive adhesive 7 such as silver. Then, the recess 8a is filled with a sealing resin 9, and the surface of the filled sealing resin 9 is flatly polished for exposing a flange section 8b of the metal case 8 and a terminal surface 4a of Cu wiring 4 of a semiconductor chip 1. In addition, a bump terminal 6 is mounted to a specific position at the flange section 8b, and the terminal surface 4a by solder for electrically and mechanically connecting to a circuit board. |
