| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent failures caused by characteristic abnormality in a local TFT due to an electrification inhibitor, and pattern failures possibly caused by the particle of the sublimate of HMDS. SOLUTION: When an insulating board 1 placed on a hot plate HPT for resist baking is peeled off, at least two of hoist pins HP1 to HP4 is raised with time difference, thus preventing the generation of electrification without applying any electrification inhibitors onto the back-surface side of the substrate. Also, when a film containing a silicon material is to be machined, HMDS treatment is carried out in a resist application process. When a film containing a metal material is to be machined, the HMDS treatment is not carried out in the resist application process, thus preventing the pattern fail caused by the particle generated by the HMDS treatment.</p> |
