| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming the outer electrode of an electronic component which can be realized in a simple arrangement and in which conductor paste can be applied with high accuracy. SOLUTION: A chip 2 fed from a chip feeder 20 is sucked at a chip holding part 23 formed at the circumferential edge part of a disc-like chip carrying plate body 21, outer surface of the chip 2 is coated with conductive paste at a coater 30 by turning the chip carrying plate body 21 and then the conductive paste adhering to the chip 2 is dried at a dryer 50 by turning the chip carrying plate body 21 furthermore.</p> |
