| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging device for high frequency, which has favorable high-frequency characteristics. SOLUTION: In a packaging device for high frequency, which is provided with a base plate 11, a conducting layer 13, which is formed on the backside of a wall part made of ceramics and is bonded to the plate 11, a conducting layer 16 formed on the surface of the wall part, the wall part, which is penetrated by strip conductors 17a and 17b, and a plurality of via holes 18 for electrically connecting the layer 13 on the lower surface of this wall part with the layer 16 on the surface of the wall part, the length in the directions of extension of the conductors 17a and 17b is formed into a long hole longer than the length of through holes formed in a pair of via holes 19a and a pair of via holes 19b, which are adjacent to each other on both sides of the conductors 17a and 17b, respectively.
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