| 摘要 |
PROBLEM TO BE SOLVED: To provide a rotary application device and a film formation method for uniformly forming a resist film on a substrate, especially, on a square substrate. SOLUTION: This rotary application device has a rotary cup 1 that has an exhausting port 5 that can be rotated with a center shaft as a center, has an open upper section 4, and discharges gas flowing in from the open upper section 4, and retains the substrate S inside while the upper surface becomes vertical to the center shaft, a breathing filter 23 that can block the opening section 4, a lid 25 that is arranged on the filter 23 and does not have any permeability, and an interval adjustment mechanism that can adjust the interval between the filter 23 and the upper surface of the substrate S retained in the rotary cup 1. |
