| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device of multi-chip flat press welding structure in which thermal fatigue test resistance can be enhanced. SOLUTION: A plurality of semiconductor chips 5 are clamped, from the opposite sides thereof, by a plurality of first and second heat shock absorbing plates 6 and 7 and under a state where the first heat shock absorbing plate, the semiconductor chips and the second heat shock absorbing plate are stacked, they are pressed collectively by means of first and second press welding electrodes 1 and 2. The first and second press welding electrodes have metal posts at positions corresponding, respectively, to the first and second heat shock absorbing plates. Each metal post of the first press welding electrode and each first heat shock absorbing plate are meshed by a first guide 3 of insulating material and positioned. Each metal post of the second press contact electrode and each second heat shock absorbing plate are meshed by a second guide 4 of insulating material and positioned. Furthermore, vertical positioning is performed by meshing the first and second guides.</p> |
