发明名称 BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a bonding device, capable of utilization of a servo motor without sacrificing positioning accuracy or tracking characteristics. SOLUTION: A rotary head 11 is provided via a holding part 12 on the bonding device to provide the servo motor. The drive pulley of the servo motor is connected to the rotary head 11 via a timing belt 24, and a rotating mechanism rotating a collet is constituted. First and second load-imparting members 32, 33 energizing the side of the rotary head 11 to the direction deviated from the rotation center 31 on the holding part 12 to apply load on the rotary head 11 are provided. The load-imparting members 32, 33 are constituted of a cylinder body, a ball housed in the cylinder body and a coil spring 37, for urging in the direction for projecting the ball and pushing on the side of the rotary head 11.
申请公布号 JP2002110705(A) 申请公布日期 2002.04.12
申请号 JP20000293568 申请日期 2000.09.27
申请人 NIDEC TOSOK CORP 发明人 KOBAYASHI ATSUYUKI;NAKATOMI YOSHIHARU
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
代理机构 代理人
主权项
地址