| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor emission device and its manufacturing method for preventing deterioration of a die-bonding member and having little lowering of emission efficiency under a long-time usage environment. SOLUTION: In the semiconductor emission device fixing a semiconductor emission element by the die-bonding member on the base substance, the die bond member is an epoxy resin composition comprising an alicyclic epoxy resin, without containing double bonding, and the epoxy resin composition is cured through thermal cationic polymerization. |
