| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved three-piece wafer support assembly which regulates temperature by holding a large-diameter semiconductor wafer. SOLUTION: A stage for mounting a ring which binds a cradle on the bottom face of a ceramic pack is included. A composite cooling plate structure is brazed on the bottom face of the ceramic pack at low temperature, and a cradle binding ring surrounds the composite cooling plate structure. Thereafter, the cradle is welded on the cradle binding ring by an electron beam.
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