| 摘要 |
PROBLEM TO BE SOLVED: To prevent breakage of a protection circuit by external force and achieve overall miniaturization. SOLUTION: A protection circuit 30 and a battery body 20 are accommodated in a battery case 11. While forming a flat surface 34A opposite the circuit board 31, a mold resin layer molding an electronic parts 32 is formed on the protection circuit 30. The battery case 11 is accommodated in a state in which the flat surface 34A of the mold resin layer 34 is brought into contact with the flat surface of the battery body 20.
|
