| 摘要 |
PROBLEM TO BE SOLVED: To achieve a printed-wiring board that can add a shield layer with sufficient thickness between a component and the component surface of the printed-wiring board. SOLUTION: An electronic component 5 is mounted on a the printed-wiring board 1. Below the electronic component 5, a recess 7 is provided. The recess 7 is filled with a shield material 8. The shield material 8 includes a conductive material, a magnetic material, or a radio wave absorber, thus allowing the shield material 8 having a sufficient thickness to be arranged near the component 5.
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