发明名称 METHOD FOR MOUNTING COMPONENT AND COMPONENT-MOUNTING MODULE
摘要 PROBLEM TO BE SOLVED: To enable a defective part to be repaired and changed, without requiring a high-processing precision in the structure design of the structure around amounted part. SOLUTION: Thermal expansion resin 2 (thermosetting resin) is adhered to the inside of a shielding case 1, and the part 4 (the part to be loaded) is mounted on a substrate 3, and after the shield case 1 has been placed and fixed, the thermal expansion resin 2 is heated from the shielding case 1, and further, this thermal expansion resin 2 is cured in a state of the thermal expansion by raising the temperature of the resin to reach the curing temperature.
申请公布号 JP2002110734(A) 申请公布日期 2002.04.12
申请号 JP20000292390 申请日期 2000.09.26
申请人 SONY CORP 发明人 HIRAI SHINJI
分类号 H01L21/60;H01L23/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址