| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method for cleaning wafers after wire saw, which can provide a uniform gap between the wafers and can enhance a wafer cleaning effect, by injecting a vapor of a mixture of a cleaning solution and a gas or a vapor of the cleaning solution into gaps between the wafers. SOLUTION: In an apparatus 10 for cleaning wafers after wire saw, a plurality of wafers 16 formed by slicing an ingot 11 held in a holding base 13 in a direction crossed by an axial line into thin plates are cleaned while held in the holding base 13. The ingot 11 is held in a gas atmosphere. The apparatus includes nozzles 27 for injecting a mixture of a cleaning solution and a gas into gaps G between the wafers 16 and a movement means 25 for changing a relative position between the nozzles 27 and wafers 16 in the axial line direction, and cleans the wafers 16 by the injection of the mixture.
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