| 摘要 |
PROBLEM TO BE SOLVED: To overcome a problem in which a mounted electronic component cannot be normally connected to an external electric circuit for a long period due to peeling of a nickel plating layer from a solder. SOLUTION: This wiring board 2 is formed by bonding a plating layer obtained by successively laminating a nickel plating layer 9 and a gold plating layer 10 on a surface of a wiring conductor 2 formed on an insulating substrate 1. The nickel dissolving current of the plating layer is 10μA or lower per mm2 of the plating layer when a voltage of +200 mV is applied to the wiring conductor 2 in a 5% water solution of sulfuric acid at 25 deg.C.
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