| 摘要 |
PROBLEM TO BE SOLVED: To provide packaging technique which reduces earth inductance and has excellent high-frequency characteristics. SOLUTION: This semiconductor device is constituted by electrically connecting a semiconductor chip mounted in a semiconductor chip mount area of a tab and a lead which is arranged as an external terminal at the periphery of the tab and exposed to outside the seal; and a bonding area of the tab and a pad for the power circuit of the semiconductor chip are electrically connected, part of the tab is exposed to outside the sealing body, and the exposed part of the tab is used as an external terminal for the semiconductor device. The exposed part of the tab is used as the external terminal for an earth power source, so a transmission line is made shorter than that of a conventional semiconductor device which uses a lead as an external terminal and its sectional area increases, so low inductance and low impedance can be obtained.
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