SUBSTRATE FOR ELECTRONIC CIRCUIT AND ELECTRONIC MODULE USING SUBSTRATE FOR ELECTRONIC CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a new type substrate for an electronic circuit, which is not remarkably reduced of its heat transfer power, free from developing a mechanical stress, is simplified its structure and is low in its manufacturing cost. SOLUTION: A substrate for an electronic circuit is provided with a wafer (1) of silicon Si with the upper surface covered with an electrically insulating layer (3) of silicon nitride SiN and supports more than one of conductive tracks (4) obtainable by metallizing the upper surface of the layer (3) are supported by the layer 3 for enabling the connection of more than one of electronic components (5) with each other.