APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component capable of preventing a connecting fault by correctly holding a pushing amount of the component. SOLUTION: The method for mounting the electronic component comprises the steps of picking up the component 7 by a suction nozzle 6 of a transfer head, and mounting the component on a board 12. The method further comprises the steps of measuring a height position of a lower surface of the component 7 of the state sucked and held by the nozzle 6 by a height measuring unit provided at an index moving route from a picking-up position to a mounting position, controlling a height of a movable table for holding the board 12 based on the height position measured result of the lower surface of the component 7 at the mounting time of the component 7 at the mounting position, and holding a prescribed gap (f) between the upper surface of an electrode 12a and the lower surface of the component 7. Thus, a suitable pushing amount of a cream solder S can be held.