| 摘要 |
PROBLEM TO BE SOLVED: To lighten the burden of an operator in finding causes when the thickness of an application film formed on a substrate surface is measured, and abnormality in the film thickness distribution of the application film is confirmed. SOLUTION: A substrate where the application film is formed is retained by a chuck in a film thickness measurement unit, the thickness of the application film is measured, and it is judged whether the difference between the maximum and minimum values of film thickness is larger than a preset value or not based on the measured result. When the difference is larger than the preset value, a reference substrate where the application film is not formed is retained by the chuck, light is applied to four measurement points where the concentric circle on the substrate surface is equally divided in a circumferential direction from a probe, and the reflection intensity is measured. When the reflection intensity at the four points is within a setting range, it is judged that problems exist in each process for forming the application film. Conversely, when either reflection intensity exceeds the setting range, it is found that the chuck is inclined. |
