| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device in which heat resistance and reliability can be enhanced by cooling elements of high heating value efficiently. SOLUTION: A semiconductor bare chip 11 is flip-chip mounted on a circuit board 10 while directing the semiconductor element forming face downward and a metal plate 13 is placed on the semiconductor chip 11 through resin 14 having high thermal conductivity. Furthermore, a spring 16 is provided between the metal plate 13 and wiring 15 formed on the circuit board 10 and bonded to the metal plate 13 and the wiring 15 through resin 17 having high thermal conductivity. Heat generated from the semiconductor substrate side of the semiconductor chip 11 is dissipated from the metal plate 13.</p> |
